Topics

  • Materials (4)
  • RF/Microwave (6)
  • IMPCB/MCPCB (1)
  • Flex/Rigid Flex (3)
  • Thermal Management (5)
  • Fundamentals (6)
  • Specialty (1)
  • Most Watched (4)

We’re inviting you to join our free Webinar Wednesdays!

American Standard Circuits is announcing our new Webinar Wednesday series. We will be hosting free Webinars every Wednesday, each week focusing on a specific PCB topic. Our experts will be there to answer any questions you may have!

Upcoming Webinars

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  • PCB Designers Toolbox: Fundamentals of Flex and Rigid-Flex

    March 23 @ 11:00 am CST

    Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.

    More Info Register
    PCB Designers Toolbox: Fundamentals of Flex and Rigid-Flex
    Flex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective. Some of the topics we will cover in this interactive:
    • Benefits of Flex circuits
    • Different types of flex circuits
    • Flex material options and selection criteria
    • Unique DFM considerations for flex / rigid-flex PCB
    • Designing cost effective flex / rigid-flex circuits
    • Impact of changes in designs on cost, manufacturing and reliability

  • PCB Designers Toolbox: Best Practices for Fabrication Notes

    April 20 @ 11:00 am CST

    We will cover the importance of fab notes in the quote process, best practices for Flex and RF, and more.

    More Info Register
    PCB Designers Toolbox: Best Practices for Fabrication Notes
    Fabrication notes communicator the designers requirements to the PCB fabricator. In this interactive webinar we will cover:
    • The importance of fabrication notes in the quote process and manufacturing of PCB’s
    • Best practices for rigid, flex and rigid-flex fab notes
    • A check list for fab notes

  • Design Guidelines associated with Unique RF Features

    June 16 @ 11:00 am CDT

    This webinar will discuss various design considerations associated with RF applications including cavities, edge plating, structural recesses and heat sinks.

    More Info Register
    Design Guidelines associated with Unique RF Features
    Many RF boards have cavities and / or edge plating. Cavity PCB’s have structural recesses to enable additional functionality and can be seen in a number of different RF applications. These types of features allow insertions of heat sinks. The inner cavity surface can also be used for electrical contact, normally a ground connection. Edge plating may be required to improve EMI shielding and / or improve chassis ground in electronic systems. This webinar will discuss various design considerations associated with these specific features.

  • Next Gen Line/Space Capability for PCB Designs (Pt 2)

    May 12 @ 11:00 am CDT

    This webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.

    More Info Register
    Industry Experts Discuss New Cutting-Edge technology. This will take your PCBs to the next level!

  • Rogers- Adhesive and Bonding Material Options for High Frequency PCBs

    May 26 @ 11:00 am CDT

    The focus of this presentation will be on the adhesive and bonding material options for high frequency printed circuit designs. We will examine the electrical, mechanical, and thermal performance parameters which all need to be factored into final adhesive choice.

    More Info Register
    Industry Experts Discuss New Cutting-Edge technology. This will take your PCBs to the next level!

  • Aismalibar Thermal Management Materials

    March 10 @ 10:00am CST

    This webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.

    More Info Register
    Aismalibar Thermal Management Materials
    This webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.

  • Taiyo’s Solution for Thermal Management

    March 24 @ 10:00am CST

    We’ll discuss the electronics industry’s growing need for materials to handle extreme heat and our solution which includes high temperature resistant solder mask and heat dissipating products.

    More Info Register
    Taiyo’s Solution for Thermal Management
    ASC is joining Taiyo to present thermal management materials. We’ll discuss the electronics industry growing need for materials to handle extreme heat and our solution which includes high temperature resistant solder mask and heat dissipating products. We’ll go over a brief history of solder mask as well as what is causing the need for thermal management and discuss solutions for solder mask and heat dissipating materials.

  • Z-Axis Interconnects: Game Changing Innovations

    April 14 @ 11:00 am CDT

    Advanced methods to create a “Z-Axis” connection are being utilized in many applications. Transient Liquid Phase Sintering (TLPS) Materials, which is the use of copper sintering paste, i.e., Ormet® Paste Z-Interconnects instead of plating.

    More Info Register
    Taiyo’s Solution for Thermal Management
    ASC is joining Taiyo to present thermal management materials. We’ll discuss the electronics industry growing need for materials to handle extreme heat and our solution which includes high temperature resistant solder mask and heat dissipating products. We’ll go over a brief history of solder mask as well as what is causing the need for thermal management and discuss solutions for solder mask and heat dissipating materials.

  • Aismalibar Thermal Management Materials

    March 10 @ 10:00am CST

    This webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.

    More Info Register
    Aismalibar Thermal Management Materials
    This webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.

  • Taiyo’s Solution for Thermal Management

    March 24 @ 10:00am CST

    We’ll discuss the electronics industry’s growing need for materials to handle extreme heat and our solution which includes high temperature resistant solder mask and heat dissipating products.

    More Info Register
    Taiyo’s Solution for Thermal Management
    ASC is joining Taiyo to present thermal management materials. We’ll discuss the electronics industry growing need for materials to handle extreme heat and our solution which includes high temperature resistant solder mask and heat dissipating products. We’ll go over a brief history of solder mask as well as what is causing the need for thermal management and discuss solutions for solder mask and heat dissipating materials.

  • Avoiding the Most Common PCB Failure Modes by Insulectro

    November 11 @ 11:00am CST

    Attendees will learn solutions to help avoid the most common failure points in today’s circuits. Bad data creates manufacturing failure points. Working with your supply chain learning from them how good data will process better.

    More Info Register
    Avoiding the Most Common PCB Failure Modes by Insulectro
    With this presentation, attendees will learn solutions to help avoid the most common failure points in today’s circuits. Bad data creates manufacturing failure points. Working with your supply chain learning from them how good data will process better. Learn where these failure points come from and what you can do to prevent them from occurring. This results in a board with high reliability and producibility, this approach is the key to product success.

    Design For:

    DFSolvability
    DFPerformance
    DFManufacturability
    Today’s dense, high-speed circuits have competing requirements and all these perspectives must be considered as they play a part of the design, manufacturing, and performance of our end products. Failure can come in the following forms.

    Not meeting aggressive product schedules
    Technical performance, (SI) signal integrity and EMC concerns
    Low manufacturing reliability and producibility which equates to cost drivers
    This presentation will look at design, fabrication and assembly
    Attendees will receive an understanding of how to implement pro-active solutions rather than re-active responses. The best way to beat a failure point is to preclude it.

  • Impact of Design Features on PCB Cost

    November 18 @ 11:00am CST

    We will discuss the cost impact of various design features that impact the cost of printed circuit boards.

    More Info Register
    Impact of Design Features on PCB Cost
    We will discuss the cost impact of various design features that impact the cost of printed circuit boards.

  • Placement & Routing High Speed Boards by Insulectro

    Attendees will receive many examples of how to route a board with most all the concerns of today’s 5G performance challenges. Dense HS-Digital and RF concerns, signal Integrity improvements, Shielding and Isolation to reduce Emissions.

    More Info Watch
    Placement & Routing High Speed Boards by Insulectro
    With this presentation, attendees will receive many examples of how to route a board with most all the concerns of todays 5G performance challenges. Dense HS-Digital and RF concerns, Signal Integrity improvements, Shielding and Isolation to reduce Emissions.

  • Panasonic Advanced Materials for High Speed, HDI and Flexible Printed Circuits

    49 minutes

    This webinar will review the newest member of Panasonic’s Megtron family of products, Megtron 7GN and the Felios R-F705S family of low loss adhesiveless flexible circuit materials.

    More Info Watch
    Panasonic Advanced Materials for High Speed, HDI and Flexible Printed Circuits
    Panasonic who has been the industry pioneer in the HSLL market segment with its Megtron 6 series product line. Recently Panasonic introduced the newest member of this family of products, Megtron7GN. Megtron 7GN has been developed for very low loss circuits that can be manufactured commercially for high layer PCB’s allowing for multiple lamination cycles while maintaining electrical, thermal and mechanical integrity. Megtron 7GN offers leading ultra-high-speed low loss HSLL performance with improved processing.
    Flexible circuit growth globally is twice rigid and multilayer with dramatic growth planned for 5G applications and unique hybrid rigid flex design. The Panasonic Felios RF705S LCP flexible materials and R-BM-17 specialty low loss bond-plies have been developed to offer breakthrough performance for these segments. In the past manufacturing multilayer and rigid flex designs with LCP has been challenging to fabricators due to the difficult lamination cycles required to bond the layers together. The R-BM-17 low loss bond ply has significantly reduced this challenge with processing similar to legacy polyimide coverlay and bond-ply. In addition, the R-BM-17 material can also be used with Panasonic’s R-F775 polyimide flex materials to create a low cost HSLL flex circuit alternative.

  • IMPCB — Aismalibar

    64 minutes

    This exciting webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.

    More Info Register
    IMPCB — Aismalibar
    This exciting webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials. Aismalibar produces a world class IMS (insulated metal substrate) product to assist engineers and designers in removing this excess heat. In addition, new IMS material, improves solder joint fatigue in PCB utilized in advanced system critical applications like LED automotive headlamps. Aismalibar has developed multiple specially designed products to not only dissipate excessive heat from PCB modules, but to also enable bendable LED tail light assembles. This webinar will cover the various laboratory test methods associated with quality control of IMPCB laminate materials, thermal conductive measurements as well as superior dielectric properties. As well as, long term reliability studies performed on their IMS materials. We will also discuss the various materials that Aismalibar produces to manufacture single sided, double sided and multi-layer IMPCB structures.

  • PCB 101

    49 minutes

    A step by step presentation of the fundamentals of printed circuit fabrication.

    More Info Watch
    PCB 101
    A step by step presentation of the fundamentals of printed circuit fabrication. Topics in this webinar include:
    • How is a multi-layer printed circuit board manufactured?
    • What are some of the design aspects you should consider when designing your PCB?
    • How can your PCB design impact cost?

  • Flex/Rigid Flex: Materials, DFM and Cost Impacts

    54 minutes

    Flex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.

    More Info Watch
    Flex/Rigid Flex: Materials, DFM and Cost Impacts
    Flex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.
    • What are the benefits of Flex circuits?
    • What are the different types of flex circuits?
    • What are the different flex material options and selection criteria?
    • What are some of the unique DFM considerations for flex / rigid-flex PCB?
    • What things need to be considered while designing cost effective flex circuits?
    • How have changes in designs impacted cost / manufacturing and reliability?

  • Surface Finishes

    61 minutes

    PCB surface finishes are critical for assembly process and impact the functionality of the application. We will describe the various surface finish options available for printed circuit boards.

    More Info Watch
    Surface Finishes
    PCB surface finishes are critical for assembly process and impact the functionality of the application. We will describe the various surface finish options available for printed circuit boards.
    • What is the purpose of the PCBs surface finish? Why does it matter?
    • What are the different surface finish options available?
    • What criteria should we use in selecting a surface finish?
    • What are the pro’s & con’s of the various surface finishes available?
    • What are new and emerging surface finishes I should know about?

  • Controlled Impedance- PCB Fabrication to Signal Integrity

    60 minutes

    Many PCB’s require controlled impedance circuits. This webinar represents a complete overview of this requirement.

    More Info Watch
    Controlled Impedance- PCB Fabrication to Signal Integrity
    Many PCB’s require controlled impedance circuits. This webinar represents a complete overview of this requirement.
    • What are the implications of controlled impedance to the PCB manufacturing process?
    • What are the various structures?
    • How can you work with your PCB fabricator during the design process to minimize cost impacts?
    • What are the implications of controlled impedance on Signal Integrity?

  • PCB Fab Notes

    57 minutes

    We will discuss best practices for PCB Fabrication notes and their importance.

    More Info Watch
    PCB Fab Notes
    We will discuss best practices for PCB Fabrication notes and their importance.
    • How do Fab notes fit in the quote process?
    • What are the minimum requirements for data supplied?
    • What are the common issues with the data itself?

  • Documentation for Flex and Rigid Flex

    45 minutes

    We will discuss best practices for documentation of Flex and Rigid-Flex PCB’s as well as what mistakes to avoid.
    * What are best practices for documentation of Flex and Rigid-Flex PCB’s?
    * What are the common mistakes to be avoided?

    More Info Watch
    Documentation for Flex and Rigid Flex
    We will discuss best practices for documentation of Flex and Rigid-Flex PCB’s as well as what mistakes to avoid.
    • What are best practices for documentation of Flex and Rigid-Flex PCB’s?
    • What are the common mistakes to be avoided?

  • IMPCB – Ventec

    64 minutes

    This webinar focuses on the critical industry need for heat dissipation through PCB laminate materials.

    More Info Watch
    IMPCB – Ventec
    This webinar focuses on the critical industry need for heat dissipation through PCB laminate materials.
    • How does Ventec IMS assist in removing waste heat?
    • How does Ventec products help promote strong solder joint integrity?

  • IMPCB/MCPCB

    35 minutes

    This webinar will focus on various IMPCB or MCPCB applications, plus Metal core technologies

    More Info Watch
    IMPCB/MCPCB
    This webinar will focus on various IMPCB or MCPCB applications, plus Metal core technologies
    • What are the different IMPCB or MCPCB applications?
    • What technologies are used?
    • What are the critical design parameters and processes?
    • What Metal core technologies are available?
    • What are their critical design parameters?
    • What material options are available for metal core?

  • Copper Foil

    49 minutes

    We discuss the manufacturing process for copper foil.

    More Info Watch
    Copper Foil
    We discuss the manufacturing process for copper foil
    • What are the different kinds of copper foil available?
    • What are the pro’s and con’s of the various foils?
    • What are the implications from a design perspective?
    • When should advanced copper foil offering such as MicroThin be utilized?

  • Understanding Pattern Plating

    60 minutes

    An understanding of pattern plating will help RF Microwave PCB designers.

    More Info Watch
    Understanding Pattern Plating
    An understanding of pattern plating will help RF Microwave PCB designers
    • What are the IPC requirements for plating and pattern plating?
    • What implications do these requirements imply from a design perspective.
    • What implications does this have for thick copper plating?

  • Embedded Capacitance

    79 minutes

    We will have guest speakers from DuPont and Oak-Mitsui

    More Info Watch
    Embedded Capacitance
    We will have guest speakers from DuPont and Oak-Mitsui
    • How can you use Embedded Capacitance materials?
    • How can you solve the challenges of Power Delivery?

  • RF Materials- Rogers

    67 minutes

    We will discuss the various high frequency material offerings from Rogers Corporation.

    More Info Watch
    RF Materials- Rogers
    We will discuss the various high frequency material offerings from Rogers Corporation.

  • RF Materials- Isola

    52 minutes

    material offerings from Isola Corporation.

    More Info Watch
    RF Materials- Isola
    We will discuss the various high frequency material offerings from Isola Corporation.

  • Via Fill

    62 minutes

    An overview of Via Fill

    More Info Watch
    Via Fill
    An overview of Via Fill
    • What Via Fill options are available?
    • What are the pros and cons of the different available options?
    • What are the design cost implications?

  • RF Materials- AGC Nelco

    54 minutes

    We will discuss the various high frequency material offerings from AGC-Nelco.

    More Info Watch
    RF Materials- AGC Nelco
    We will discuss the various high frequency material offerings from AGC-Nelco.

Most Viewed Webinars

  • PCB 101

    49 minutes

    A step by step presentation of the fundamentals of printed circuit fabrication.

    More Info Watch
    PCB 101

    A step by step presentation of the fundamentals of printed circuit fabrication.

    Topics in this webinar include:

    • How is a multi-layer printed circuit board manufactured?
    • What are some of the design aspects you should consider when designing your PCB?
    • How can your PCB design impact cost?

  • Flex/Rigid Flex: Materials, DFM and Cost Impacts

    54 minutes

    Flex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.

    More Info Watch
    Flex/Rigid Flex: Materials, DFM and Cost Impacts
    Flex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.

    * What are the benefits of Flex circuits?
    * What are the different types of flex circuits?
    * What are the different flex material options and selection criteria?
    * What are some of the unique DFM considerations for flex / rigid-flex PCB?
    * What things need to be considered while designing cost effective flex circuits?
    * How have changes in designs impacted cost / manufacturing and reliability?

  • PCB Fab Notes

    57 minutes

    We will discuss best practices for PCB Fabrication notes and their importance.

    More Info Watch
    PCB Fab Notes
    We will discuss best practices for PCB Fabrication notes and their importance.

    * How do Fab notes fit in the quote process?
    * What are the minimum requirements for data supplied?
    * What are the common issues with the data itself?

You can trust us

AS&R Circuits India Pvt. Ltd. is a joint venture of American Standard Circuits Inc.(ASC) and Ronak Circuits Pvt. Ltd.(RCPL). ASC is a premier PCB manufacturing company established in 1988 and has a manufacturing facility in USA. ASC's core strengths are RF / Microwave, Flex, Rigid-Flex, Metal-backed, Metal Core, High Speed Digital and HDI PCBs. RCPL was established in 2012 and has a manufacturing facility in Gujarat, India.

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AS&R Circuits India Pvt. Ltd is a PCB Manufacturer based in Buckingham | Berkshire | London | Surrey


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